第十四届先进陶瓷国际会议
Invited Speakers
S1.先进结构陶瓷和复合材料前沿:从日常使用到极端高温
S2.纳米层状碳化物/氮化物/硼化物及其二维材料
S3. 聚合物前驱体陶瓷
S4. 陶瓷基复合材料前沿
S5. 多孔陶瓷及其在能源与环境中的应用
S6.  先进耐火材料与传统陶瓷
S7.  透明陶瓷与发光材料
S8. 新型陶瓷涂层与技术
S9.  粉体工艺与烧结前沿
S10.3D 打印和增材制造进展
S11.  热电材料与器件
S12. 铁电与压电陶瓷
S13.  铁电与多铁薄膜
S14.  先进储能电介质材料
S15.  新兴光伏材料和器件
S16. 高熵陶瓷:极端环境下设计、加工和应用的创新
S17.  陶瓷材料纳米级表征
S18. 微波介电陶瓷及其应用
S18: Microwave Dielectric Ceramics and applications

Microwave dielectric ceramics play a key role in the evaluation of wireless communication technology because of their important applications as microwave/millimeter-wave resonators, filters, microwave attenuation and shielding, etc. On the other hand, new devices with superior performance are currently being developed to respond to the requirement of increased channel capacity in ground-based cellular and satellite communications. Device performance is closely related to material properties. In order to meet the needs of present and future microwave systems, improved or new components based on microwave dielectric ceramics and new designs are required. This symposium provides a forum for the worldwide microwave communities from academia and industry to share their vision and insights for microwave dielectric ceramics, to boost the research and development of microwave dielectric ceramics and promote their applications in 5G/6G, V2X, satellite communication/navigation and other information systems.

Proposed sessions :
1. Novel microwave and millimeter-wave dielectric ceramics
2. LTCC/ULTCC materials
3. Microwave absorbing and shielding materials
4. Cold sintering and other novel process for ceramics preparation
5. Components/devices/microsystems based on microwave dielectric ceramics
6. Metamaterials, metasurface and advanced artificial structures
7. Microwave dielectric ceramics and devices design/modeling/simulation/measurements
8. 3D printing /photolithography and other emerging microwave/millimeter wave devices fabrication/integration technologies
9. Microwave circuits package and integration
10. Other microwave dielectric materials related emerging topics

Organizers:
Xiangming Chen, Zhejiang University, China, E-mail: Xmchen59@zju.edu.cn
Hong Wang, Southern University of Science and Technology, China, E-mail: wangh6@sustech.edu.cn
Heli Jantunen, University of Oulu, Finland, E-mail: hjantune@univ.yo.oulu.fi
Jörg Töpfer, Ernst Abbe University of Applied Sciences Jena, Germany, E-mail: Joerg.Toepfer@eah-jena.de
Yang Bai ,University of Science and Technology Beijing, China, E-mail: baiy@mater.ustb.edu.cn
Xiaoxiao Huang, Harbin Institute of Technology, China, E-mail: swliza@hit.edu.cn
Do-Kyun Kwon, Korea Aerospace University, Korea, E-mail: dkwon@kau.ac.kr
Zhifu Liu, Shanghai Institute of Ceramics, CAS, China, E-mail: liuzf@mail.sic.ac.cn
Di Zhou, Xian Jiaotong University, China, E-mail: zhoudi1220@xjtu.edu.cn
Akinori Kan, Meijo University, Japan, E-mail:akan@meijo-u.ac.jp
Jobin Varghese, Fraunhofer Institute for Ceramic Technologies and Systems IKTS, Germany, E-mail: jobin.varghese@ikts.fraunhofer.de
Wen Lei, Huazhong University of Technology, China, E-mail: wenlei@mail.hust.edu.cn
Lei Li, Zhejiang University, China, E-mail: zjulilei@zju.edu.cn
Feng Shi, Qilu University of Technology, China, E-mail: sf751106@qlu.edu.cn

Point of Contact:
Zhifu Liu, Shanghai Institute of Ceramics, CAS, China, E-mail: liuzf@mail.sic.ac.cn

Keynote Speakers:
Xiangming Chen, Zhejiang University, China
Hong Wang, Southern University of Science and Technology, China
Heli Jantunen, University of Oulu, Finland
Zhenxin Yue, Tsinghua University, China
Jörg Töpfer, Ernst Abbe University of Applied Sciences Jena, Germany
Jianjiang Bian, Shanghai University, China
Liang Fang, Guilin University of Technolgy, China

Invited Speakers:
Yang Bai, University of Science and Technology Beijing, China
Weijia Guo, Tsinghua University, China
Xiaoxiao Huang, Harbin Institute of Technology, China
Do-Kyun Kwon, Korea Aerospace University, Korea
Akinori Kan, Meijo University, Japan
Lei Li, Zhejiang University, China
Wen Lei, Huazhong University of Science and Technology, China
Enzhu Li, University of electronic science and technology of China
Mingsheng Ma, Shanghai Institute of Ceramics,CAS, China
Jun Qiu, Tongji University, China
Yongzheng Wen, Tsinghua University, China
Kaixin Song, Hangzhou Dianzi University, China
Feng Shi, Qilu University of Technology, China
Bo Zhong, Harbin Institute of Technology (Weihai), China
Xiaoli Zhu, Zhejiang University, China
Di Zhou, Xian Jiaotong University, China
Jobin Varghese, Fraunhofer Institute for Ceramic Technologies and Systems IKTS, Germany
Daniel Tan, Guangdong Technion - Israel Institute of Technology, China
Weijun Zhang, National University of Defense Technology, China
Fangfang Wu, Ningxia University, China
Hiatao Wu, Yantai University, China
Hao Li, Hunan University, China
Changlai Yuan, Guilin University of Electronic Technology, China
......
S19.  离子及混合传导陶瓷
S20.  生物陶瓷前沿
S21.数据驱动和人工智能在陶瓷和复合材料中的应用
S22. 用于传感器件的多功能纳米材料和异质结构
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