第十四届先进陶瓷国际会议
Invited Speakers
S1.Frontiers in Advanced Structural Ceramics and composites: From Daily Use to Extreme Heat
S2.Nano-laminated Carbides, Nitrides and Borides and Their 2D Counterparts (MAX/MAB phases and MXenes/MBenes)
S3. Polymer-Derived Ceramics
S4. Advances in Ceramic Matrix Composites
S5. Porous Ceramics and Their Applications in Energy and Environment
S6.  Advanced Refractories and Traditional Ceramics 
S7.  Transparent Ceramics and Luminescent Materials
S8.  Novel Ceramic Coatings and Technology 
S9.  Advanced Powder Processing and Sintering
S10. Progress in 3D Printing and Additive Manufacturing
S11.  Thermoelectric Materials and Devices
S12. Ferroelectric and Piezoelectric Ceramics
S13.  Ferroelectric and Multiferroic thin films
S14.  Advanced Dielectrics for Energy Storage Applications 
S15. Emerging Photovoltaic Materials and Devices
S16. High-Entropy Ceramics: Innovations in Design, Processing, and Applications for Extreme Environments
S17.  Nanoscale Characterization of Ceramic materials
S18. Microwave Dielectric Ceramics and applications
S18: Microwave Dielectric Ceramics and applications

Microwave dielectric ceramics play a key role in the evaluation of wireless communication technology because of their important applications as microwave/millimeter-wave resonators, filters, microwave attenuation and shielding, etc. On the other hand, new devices with superior performance are currently being developed to respond to the requirement of increased channel capacity in ground-based cellular and satellite communications. Device performance is closely related to material properties. In order to meet the needs of present and future microwave systems, improved or new components based on microwave dielectric ceramics and new designs are required. This symposium provides a forum for the worldwide microwave communities from academia and industry to share their vision and insights for microwave dielectric ceramics, to boost the research and development of microwave dielectric ceramics and promote their applications in 5G/6G, V2X, satellite communication/navigation and other information systems.

Proposed sessions :
1. Novel microwave and millimeter-wave dielectric ceramics
2. LTCC/ULTCC materials
3. Microwave absorbing and shielding materials
4. Cold sintering and other novel process for ceramics preparation
5. Components/devices/microsystems based on microwave dielectric ceramics
6. Metamaterials, metasurface and advanced artificial structures
7. Microwave dielectric ceramics and devices design/modeling/simulation/measurements
8. 3D printing /photolithography and other emerging microwave/millimeter wave devices fabrication/integration technologies
9. Microwave circuits package and integration
10. Other microwave dielectric materials related emerging topics

Organizers:
Xiangming Chen, Zhejiang University, China, E-mail: Xmchen59@zju.edu.cn
Hong Wang, Southern University of Science and Technology, China, E-mail: wangh6@sustech.edu.cn
Yang Bai ,University of Science and Technology Beijing, China, E-mail: baiy@mater.ustb.edu.cn
Xiaoxiao Huang, Harbin Institute of Technology, China, E-mail: swliza@hit.edu.cn
Zhifu Liu, Shanghai Institute of Ceramics, CAS, China, E-mail: liuzf@mail.sic.ac.cn
Di Zhou, Xian Jiaotong University, China, E-mail: zhoudi1220@xjtu.edu.cn
Akinori Kan, Meijo University, Japan, E-mail:akan@meijo-u.ac.jp
Wen Lei, Huazhong University of Technology, China, E-mail: wenlei@mail.hust.edu.cn
Lei Li, Zhejiang University, China, E-mail: zjulilei@zju.edu.cn
Feng Shi, Qilu University of Technology, China, E-mail: sf751106@qlu.edu.cn

Point of Contact:
Zhifu Liu, Shanghai Institute of Ceramics, CAS, China, E-mail: liuzf@mail.sic.ac.cn

Keynote Speakers:
Xiangming Chen, Zhejiang University, China
Hong Wang, Southern University of Science and Technology, China
Zhenxin Yue, Tsinghua University, China
Jianjiang Bian, Shanghai University, China
Liang Fang, Guilin University of Technolgy, China

Invited Speakers:
Yang Bai, University of Science and Technology Beijing, China
Weijia Guo, Tsinghua University, China
Xiaoxiao Huang, Harbin Institute of Technology, China
Akinori Kan, Meijo University, Japan
Lei Li, Zhejiang University, China
Wen Lei, Huazhong University of Science and Technology, China
Enzhu Li, University of electronic science and technology of China
Mingsheng Ma, Shanghai Institute of Ceramics,CAS, China
Yongzheng Wen, Tsinghua University, China
Kaixin Song, Hangzhou Dianzi University, China
Feng Shi, Qilu University of Technology, China
Bo Zhong, Harbin Institute of Technology (Weihai), China
Xiaoli Zhu, Zhejiang University, China
Di Zhou, Xian Jiaotong University, China
Daniel Tan, Guangdong Technion - Israel Institute of Technology, China
Fangfang Wu, Ningxia University, China
Hiatao Wu, Yantai University, China
Hao Li, Hunan University, China
Changlai Yuan, Guilin University of Electronic Technology, China
S19.  Ionic and Mixed Conducting Ceramics 
S20.  Advances in Bioceramics 
S21.Data Driven and AI for Ceramics and Composites 
S22. Multifuctional Nanomaterials and Heterostructures for Sensing Devices
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