第十四届先进陶瓷国际会议
Invited Speakers
S1.先进结构陶瓷和复合材料前沿:从日常使用到极端高温
S2.纳米层状碳化物/氮化物/硼化物及其二维材料
S3. 聚合物前驱体陶瓷
S4. 陶瓷基复合材料前沿
S5. 多孔陶瓷及其在能源与环境中的应用
S6.  先进耐火材料与传统陶瓷
S7.  透明陶瓷与发光材料
S8. 新型陶瓷涂层与技术
S9.  粉体工艺与烧结前沿
S10.3D 打印和增材制造进展
S11.  热电材料与器件
S12. 铁电与压电陶瓷
S13.  铁电与多铁薄膜
S14.  先进储能电介质材料
S15.  新兴光伏材料和器件
S16. 高熵陶瓷:极端环境下设计、加工和应用的创新
S17.  陶瓷材料纳米级表征
S18. 微波介电陶瓷及其应用
S19.  离子及混合传导陶瓷
S20.  生物陶瓷前沿
S21.数据驱动和人工智能在陶瓷和复合材料中的应用
S22. 用于传感器件的多功能纳米材料和异质结构
S22: Multifuctional Nanomaterials and Heterostructures for Sensing Devices

Sensitive devices that can convert different physical, chemical or biological stimuli-such as mechanical, thermal, acoustic, gaseous, biological and optical signals-into electrical response, are of great potential for man-made robots to perceive the world in a manner similar to human beings. These devices can also assist individuals in exploring fields that currently inaccessible, enhance everyday life, and provide protection from potential dangers. According to their sensitive features, these materials can be classified into categories such as temperature-sensitive, gas-sensitive, voltage-sensitive, and optical-sensitive materials, among others. Correspondingly, they are developed into devices such as thermistors, gas sensors, varistors, biosensors and optical sensors. Current trends in the development of sensitive materials and devices emphasize high performance through various strategies, including low-dimensional and high-dimensional designs, low-temperature and facile preparation techniques, chip-type integration approaches, and the incorporation of flexible and stretchable features, as well as multi-functional modules. This symposium is dedicated to exploring multifunctional nanomaterials and heterostructures for sensing devices. It covers the application of these advanced materials and structures in the development of high-performance sensing devices, including gas sensors, optical detectors, thermistors, biosensors and pressure sensors. The symposium will delve into the latest research advancements in the design, fabrication, characterization and application of various heterostructures and multifunctional nanomaterials for sensing devices. Research papers on newly emerged sensitive materials, progresses in preparation and characterization techniques, and new applications and of sensitive materials and devices are all welcomed.

Proposed sessions:
1. Thermal sensitive materials and devices
2. Voltage sensitive materials and devices
3. Gas and humidity sensitive materials and sensor
4. Acoustic transducer materials and devices
5. Optical sensitive materials and detectors
6. Pressure sensitive materials and devices
7. Bio-signal sensitive materials and devices
8. Novel sensitive materials and devices
9. Multi-mode and multifunctional sensors integration technology
10. Sensing devices miniaturization and system application
11. AI-enabled sensing materials and devices

Organizers:
Zi-Long Tang, Tsinghua University, China
Qiu-Yun Fu, Huazhong Univ Sci. Technol., China
Wan-Ping Chen, Wuhan University, China
Ge-Yu Lu, Jilin University, China
Wang-Yang Fu, Tsinghua University, China, fwy2018@tsinghua.edu.cn (Point of Contact)
Chen Wang, Tsinghua University, China, chenwang0101@tsinghua.edu.cn (Point of Contact)
Wen Dong, Huazhong University of Science and Technology, China, dongw@hust.edu.cn (Point of Contact)
Daesung Park, Technical University of Denmark, Denmark, daepa@dtu.dk (Points of Contact)
Emad Kiriakous, Queensland University of Technology, Australia, e.kiriakous@qut.edu.au (Points of Contact)
Weiwei Lei, Deakin University, Australia, weiwei.lei@deakin.edu.au (Points of Contact)
Grégory F. Schneider, Leiden University, the Netherlands, g.f.schneider@chem.leidenuniv.nl (Points of Contact)
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